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Izindaba Zemboni: Uyini umehluko phakathi kwe-SOC ne-SIP (System-in-Package)?
Kokubili i-SoC (System on Chip) kanye ne-SiP (System in Package) ziyingqopha-mlando ezibalulekile ekuthuthukisweni kwamasekethe ahlanganisiwe esimanje, okuvumela ukwenziwa kweminiaturization, ukusebenza kahle, kanye nokuhlanganiswa kwezinhlelo zikagesi. 1. Izincazelo kanye Nemiqondo Eyisisekelo ye-SoC ne-SiP SoC (Isistimu ...Funda kabanzi -
Izindaba Zemboni: I-STMicroelectronics' STM32C0 Series High-Efficiency Microcontrollers Ithuthukisa Ukusebenza Ngokuphawulekayo
I-microcontroller entsha ye-STM32C071 yandisa inkumbulo ye-flash nomthamo we-RAM, yengeza isilawuli se-USB, futhi isekela isofthiwe yezithombe ze-TouchGFX, yenze imikhiqizo yokugcina ibe mncane, iminyene, futhi iqhudelane. Manje, abathuthukisi be-STM32 bangafinyelela indawo yokugcina eyengeziwe kanye nemali eyengeziwe...Funda kabanzi -
Izindaba Zemboni: Indwangu Encane Encane Ye-wafer
Emkhakheni wokukhiqiza ama-semiconductor, imodeli yendabuko yokukhiqiza utshalomali olukhulu, enemali enkulu ibhekene nenguquko engaba khona. Ngombukiso ozayo we-"CEATEC 2024", i-Minimum Wafer Fab Promotion Organisation ikhombisa isemicon entsha sha...Funda kabanzi -
Izindaba Zomkhakha: Amathrendi Obuchwepheshe Bokupakisha Okuthuthukile
Ukupakishwa kwe-semiconductor kuvele kumiklamo yendabuko ye-1D PCB kuya ekuhlanganisweni kwe-3D eyingxubevange esezingeni eliphezulu ezingeni le-wafer. Le ntuthuko ivumela isikhala sokuxhumanisa kububanzi be-micron enedijithi eyodwa, enomkhawulokudonsa ofinyelela ku-1000 GB/s, kuyilapho kugcinwa amandla aphezulu...Funda kabanzi -
Izindaba Zemboni: I-Core Interconnect ikhiphe i-12.5Gbps Redriver chip CLRD125
I-CLRD125 iyi-chip esebenza kahle futhi esebenza kaningi ehlanganisa i-dual-port 2:1 multiplexer nomsebenzi we-1:2 switch/fan-out buffer. Le divayisi yakhelwe ngokukhethekile izinhlelo zokusebenza zokudlulisa idatha ngesivinini esikhulu, ezisekela amanani edatha afika ku-12.5Gbps,...Funda kabanzi -
Itheyiphu yenkampani yenethiwekhi engu-88mm ye-radial capacitor
Elinye lamakhasimende ethu e-USA, Sep, licele itheyiphu yenkampani yenethiwekhi ye-radial capacitor. Bakugcizelele ukubaluleka kokuqinisekisa ukuthi imikhondo ihlezi ingenakonakala uma kuthuthwa, ikakhulukazi ukuthi ayigobi. Ukuphendula, ithimba lethu lonjiniyela liye laklama ngokushesha...Funda kabanzi -
Izindaba Zemboni: Imboni entsha ye-SiC isisungulwe
NgoSepthemba 13, 2024, iResonac yamemezela ukwakhiwa kwesakhiwo esisha sokukhiqiza sama-SiC (i-silicon carbide) ama-wafers kagesi e-Yamagata Plant e-Higashine City, Yamagata Prefecture. Ukuphothulwa kulindeleke kwikota yesithathu ka-2025. ...Funda kabanzi -
Itheyiphu yezinto ze-ABS engu-8mm ye-resistor engu-0805
Ithimba lethu lonjiniyela kanye nabakhiqizi lisanda kusekela elinye lamakhasimende ethu aseJalimane ukwenza iqoqo lamateyipu ukuze lihlangabezane nezinto ezimelana nezingu-0805, ezinobukhulu obusephaketheni obungu-1.50×2.30×0.80mm, obuhlangabezana kahle nezicaciso zabo zokuphikisa. ...Funda kabanzi -
Itheyiphu yenethiwekhi engu-8mm yokufa encane enembobo yephakethe engu-0.4mm
Nasi isixazululo esisha esivela eqenjini le-Sinho esingathanda ukwabelana nawe ngaso. Elinye lamakhasimende kaSinho linefa elikala u-0.462mm ububanzi, 2.9mm ubude, no-0.38mm ngogqinsi olunengxenye yokubekezelela okungu-±0.005mm. Ithimba likaSinho lonjiniyela lenze i-carri...Funda kabanzi -
Izindaba Zemboni: Gxila phambili ekulingiseni ubuchwepheshe! Siyakwamukela ku-TowerSemi Global Technology Symposium (TGS2024)
Umhlinzeki oholayo wezixazululo zenani eliphezulu le-analog semiconductor foundry, i-Tower Semiconductor, izobamba i-Global Technology Symposium (TGS) e-Shanghai ngoSepthemba 24, 2024, ngaphansi kwendikimba ethi “Ukunika amandla Ikusasa: Ukubumba Umhlaba Nge-Analog Technology Innovation... .Funda kabanzi -
Itheyiphu ye-8mm ye-PC Yenethiwekhi esanda kusetshenziswa, ithunyelwa phakathi kwezinsuku eziyi-6
NgoJulayi, ithimba likaSinho lonjiniyela nokukhiqiza liqede ngempumelelo ukukhiqiza okuyinselele kwetheyiphu yenethiwekhi engu-8mm enobukhulu bephakethe obungu-2.70×3.80×1.30mm. Lawa abekwe kutheyiphu ebanzi engu-8mm × pitch 4mm, eshiya indawo esele yokuvala ukushisa engu-0.6-0.7 kuphela...Funda kabanzi -
Izindaba Zemboni: Inzuzo yehla ngo-85%, i-Intel iqinisekisa: 15,000 ukuncishiswa kwemisebenzi
Ngokusho kukaNikkei, i-Intel ihlela ukudiliza abantu abangu-15,000. Lokhu kuza ngemuva kokuthi inkampani ibike ukuthi yehle ngo-85% inzuzo yekota yesibili ngoLwesine. Ezinsukwini ezimbili nje ngaphambili, imbangi ye-AMD imemezele ukusebenza okumangazayo okuqhutshwa ukuthengiswa okuqinile kwama-AI chips. E...Funda kabanzi
