Imakethe yomhlaba wonke yokupakisha nokuhlola i-semiconductor kulindeleke ukuthi iqhubeke nokukhula okuqhubekayo ngo-2026, iqhutshwa ukwanda kwesidingo esivela kubuhlakani bokwenziwa, i-elekthronikhi yezimoto, kanye nekhompyutha esebenza kahle kakhulu.
Abahlaziyi bezimboni baphawula ukuthi ubuchwepheshe bokupakisha obuthuthukisiwe, okuhlanganisa ukupakisha kwe-fan-out wafer-level (FOWLP), ukupakisha kwe-2.5D kanye ne-3D, kuya ngokuya kubaluleka njengoba abakhiqizi be-chip bephishekela ukuhlanganiswa okuphezulu kanye nezici ezincane zefomu.
Ukutshalwa kwezimali okukhula ezindaweni zokukhiqiza ze-semiconductor emhlabeni wonke kusekela nokwandiswa kochungechunge lokuphakelwa kwamaphakheji. Njengoba amadivayisi kagesi eba ahlakaniphile futhi axhumene kakhudlwana, isidingo sezixazululo zokupakisha ezinokwethenjelwa nezinembile sizohlala siqinile emikhakheni yabathengi, yezimboni kanye neyezimoto.
Isikhathi sokuthunyelwe: Mashi-02-2026