ISan Jose - I-Samsung Electronics Co izokwethula izinsizakalo zokupakisha ezi-ntathu (3D) zememori ephezulu (i-3D) yememori ephezulu (HBM) kungakapheli unyaka, ubuchwepheshe obekulindeleke ukuthi kwethulwe nge-Chip Intelligence Chinal Model HBM4 efanelekile ngo-2025, ngokuya ngemithombo yenkampani kanye nemithombo yezimboni.
NgoJuni 20, i-chipmaker enkulu kunazo zonke emhlabeni ye-chipmaker yembula ubuchwepheshe bawo bamuva bokupakisha chip kanye nezikhala zemigwaqo e-Samsung Forry Forum 2024 ezazibanjelwe eSan Jose, eCalifornia.
Kwakungokokuqala kwaSamsung ukukhipha ubuchwepheshe bokupakisha we-3D ngama-chip we-HBM emcimbini womphakathi. Njengamanje, ama-chips we-HBM ahlanganiswe ikakhulukazi ngobuchwepheshe be-2.5D.
Kwafika cishe amasonto amabili nje ngemuva kokuhlangana ngokubambisana kweNvidia kanye nesikhulu esiphezulu Jensen Huang kwembula ukwakhiwa kwesizukulwane esisha seplatifomu yalo yepulatifomu yaso ngesikhathi senkulumo eTaiwan.
I-HBM4 izongenelwa emodeli ka-rubidia entsha ye-rubin GPU okulindeleke ukuthi ishaye imakethe ngo-2026.
Ukuxhumana okuqondile
Ubuchwepheshe bamuva bokupakisha bakwa-Samsung bunama-chips we-HBM agxiliwe ngokuqondile ngaphezulu kwe-GPU ukuze aqhubekele phambili ukucubungula idatha nokuhlobisa kwedatha, ubuchwepheshe obuthathwa njengenguquko yegeyimu ekhula ngokushesha kwe-AI Chip Market.
Njengamanje, ama-chips we-HBM axhumeke ngokuqondile ne-GPU ku-Silicon Interper
Ngokuqhathanisa, ukupakishwa kwe-3D akudingi i-silicon ihumushela, noma i-substrate emincane ehlala phakathi kwama-chips ukuwavumela ukuthi akwazi ukuxhumana futhi asebenze ndawonye. I-Samsung Dubs ubuchwepheshe bayo obusha bokupakisha njenge-Saint-D, imfushane nge-Samsung Advanced interconconnection Technology-D.
Insiza ye-turnetkey
Inkampani yaseSouth Korea iyaqondakala ukunikela nge-3D HBM Packal on a turkey.
Ukuze wenze njalo, iqembu layo lokupakisha elithuthukisiwe lizoxhumanisa ama-HBM ama-HBM akhiqizwa ekuhlukaniseni ibhizinisi lememori nge-GPU aqoqene nezinkampani ezifuywayo.
"Ukupakishwa kwe-3D kunciphisa ukusetshenziswa kwamandla nokucubungula ukubambezeleka, ukuthuthukisa ikhwalithi yamasiginali kagesi ama-semiconductor chips," kusho isikhulu se-Samsung Electronics. Ngo-2027, ama-Samsung ahlela ukwethula ubuchwepheshe bokuhlanganisa obunama-heterogeneous afaka ama-heterogeneous
Ngokuhambisana nesidingo esikhulayo sama-aw-a manzi, ama-chip asebenza kakhulu, i-HBM kubhekiswe ekwakheni ama-30% emakethe ye-DRAM ngo-2025 kusuka ku-2024 ngonyaka ka-2024, ngokusho kweTrengentforce Company.
Ukucwaninga kwe-MGI ukubikezela imakethe yokupakisha ethuthukisiwe, kufaka phakathi ukupakishwa kwe-3D, ukukhula ku- $ 80 billion ngo-2032, kuqhathaniswa nama- $ 34,5 billion ngo-2023.
Isikhathi sePosi: Jun-10-2024