I-SAN JOSE -- I-Samsung Electronics Co. izokwethula izinsizakalo zokupakisha ezinezinhlangothi ezintathu (3D) zememori yomkhawulokudonsa ophezulu (HBM) phakathi nonyaka, ubuchwepheshe okulindeleke kwethulwe imodeli yesizukulwane sesithupha ye-intelligence chip HBM4 ezoqala ngo-2025, ngokusho kwenkampani kanye nemithombo yemboni.
Ngomhla zingama-20 kuNhlangulana, umenzi wenkumbulo omkhulu kunawo wonke emhlabeni wethule ubuchwepheshe bakamuva bawo bokupakisha ama-chip kanye nemigwaqo yesevisi ku-Samsung Foundry Forum 2024 ebiseSan Jose, eCalifornia.
Bekungokokuqala abakwaSamsung bekhipha ubuchwepheshe bokupakisha be-3D bama-chips e-HBM emcimbini womphakathi.Njengamanje, ama-HBM chips apakishwe ikakhulukazi ngobuchwepheshe be-2.5D.
Kwafika cishe amasonto amabili ngemuva kokuba umsunguli we-Nvidia kanye noMphathi Omkhulu uJensen Huang embule ukwakhiwa kwesizukulwane esisha se-AI yayo yesikhulumi i-Rubin ngesikhathi senkulumo eTaiwan.
I-HBM4 kungenzeka ishumekwe kumodeli entsha yeRubin GPU kaNvidia okulindeleke ukuthi ifike emakethe ngo-2026.
UKUXHUMANA OKUME
Ubuchwepheshe bakamuva bokupakisha be-Samsung buhlanganisa ama-chips e-HBM apakishwe aqonde phezulu kwe-GPU ukuze kuqhutshekwe nokusheshisa ukufunda kwedatha nokucubungula okucatshangwayo, ubuchwepheshe obuthathwa njengoshintsho lomdlalo emakethe ye-chip ye-AI ekhula ngokushesha.
Njengamanje, ama-chips e-HBM axhumeke ngokuvundlile ne-GPU ku-silicon interposer ngaphansi kobuchwepheshe bokupakisha be-2.5D.
Ngokuqhathanisa, ukupakishwa kwe-3D akudingi i-silicon interposer, noma i-substrate encane ehlala phakathi kwama-chips ukuwavumela ukuthi axhumane futhi asebenze ndawonye.AbakwaSamsung babiza ubuchwepheshe bayo obusha bokupakisha ngokuthi SAINT-D, okufushane kwe-Samsung Advanced Interconnection Technology-D.
INKONZO YE-TURNKEY
Inkampani yaseNingizimu Korea kuqondwe ukuthi ihlinzeka ngamaphakheji we-3D HBM ngesisekelo se-turnkey.
Ukuze lenze njalo, ithimba layo lokupakisha elithuthukile lizoxhumanisa ama-chips e-HBM aqonde phezulu akhiqizwe esigabeni sawo sebhizinisi lenkumbulo nama-GPU aqoqelwe izinkampani ezingenasici ngeyunithi yalo yokusungula.
"Ukupakishwa kwe-3D kunciphisa ukusetshenziswa kwamandla kanye nokubambezeleka kokucubungula, kuthuthukisa ikhwalithi yezimpawu zikagesi zama-semiconductor chips," kusho isikhulu sakwaSamsung Electronics.Ngo-2027, abakwaSamsung bahlela ukwethula ubuchwepheshe bokuhlanganiswa kwe-heterogeneous all-in-one obuhlanganisa izinto ezibonakalayo ezikhuphula ngokumangalisayo isivinini sokudlulisa idatha sama-semiconductors sibe yiphakheji elilodwa elihlanganisiwe lama-accelerator e-AI.
Ngokuhambisana nesidingo esikhulayo samandla aphansi, ama-chips asebenza kahle, i-HBM kulindeleke ukuthi yenze ama-30% emakethe ye-DRAM ngo-2025 isuka ku-21% ngo-2024, ngokusho kweTrendForce, inkampani yocwaningo yaseTaiwan.
Ucwaningo lwe-MGI lubikezela imakethe yokupakisha ethuthukisiwe, okubandakanya ukupakishwa kwe-3D, izokhula ifike ku- $80 billion ngo-2032, uma iqhathaniswa nezigidigidi ezingama-34.5 zamarandi ngo-2023.
Isikhathi sokuthumela: Jun-10-2024