1. Isilinganiso sendawo ye-chip nendawo yokupakisha kufanele sisondele ku-1:1 ngangokunokwenzeka ukuze kuthuthukiswe ukusebenza kahle kokupakisha.
2. Ama-lead kufanele agcinwe mafushane ngangokunokwenzeka ukuze kuncishiswe ukubambezeleka, kuyilapho ibanga phakathi kwama-lead kufanele likhuliswe ukuqinisekisa ukuphazamiseka okuncane nokuthuthukisa ukusebenza.
3. Ngokusekelwe ezidingweni zokuphathwa kokushisa, ukupakishwa okuncane kubalulekile. Ukusebenza kwe-CPU kuthinta ngqo ukusebenza kwekhompyutha iyonke. Isinyathelo sokugcina nesibaluleke kakhulu ekukhiqizweni kwe-CPU ubuchwepheshe bokupakisha. Amasu ahlukene okupakisha angabangela umehluko omkhulu wokusebenza kuma-CPU. Ubuchwepheshe bokupakisha obusezingeni eliphezulu kuphela obungakhiqiza imikhiqizo ye-IC ephelele.
4. Kuma-IC e-baseband okuxhumana e-RF, ama-modem asetshenziswa ekuxhumaneni afana nama-modem asetshenziswa ukufinyelela i-inthanethi kumakhompyutha.
Isikhathi sokuthunyelwe: Novemba-18-2024
