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Izici eziyinhloko e-IC Carrier Prier Tacked

Izici eziyinhloko e-IC Carrier Prier Tacked

1. Isilinganiso sendawo ye-chip endaweni yokupakisha kufanele ibe seduze kwe-1: 1 ngangokunokwenzeka ukuthuthukisa ukusebenza kahle.

2. Ukuhola kufanele kugcinwe kufushane ngangokunokwenzeka ukunciphisa ukubambezeleka, ngenkathi ibanga phakathi kokuhola kufanele likhuliswe ukuze liqinisekise ukuphazamiseka okuncane nokukhulisa ukusebenza.

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3. Kususelwa kwizidingo zokuphathwa kwe-Thermal, ukufakwa okunciphile kubalulekile. Ukusebenza kwe-CPU kuthinta ngqo ukusebenza kwekhompyutha okuphelele. Isinyathelo sokugcina nesibucayi kakhulu ekukhiqizeni i-CPU ubuchwepheshe bokupakisha. Amasu ahlukene wokupakisha angaholela ekuhlukani kokusebenza okubalulekile ku-CPUS. Ubuchwepheshe obusezingeni eliphakeme bungakhiqiza imikhiqizo ephelele ye-IC.

I-4. Nge-RF Communication base Baseband ICS, amamodemu asetshenziswa ekuxhumaneni afana nemodeli esetshenziselwa ukufinyelela kwi-Intanethi kumakhompyutha.


Isikhathi sePosi: Nov-18-2024