isibhengezo secala

Izinto Eziyinhloko Ekufakweni Kwetheyiphu Yenkampani Ye-IC

Izinto Eziyinhloko Ekufakweni Kwetheyiphu Yenkampani Ye-IC

1. Isilinganiso sendawo ye-chip nendawo yokupakisha kufanele sisondele ku-1:1 ngangokunokwenzeka ukuze kuthuthukiswe ukusebenza kahle kokupakisha.

2. Imikhondo kufanele igcinwe imfushane ngangokunokwenzeka ukuze kuncishiswe ukubambezeleka, kuyilapho ibanga eliphakathi kwemikhondo kufanele lenziwe libe likhulu ukuze kuqinisekiswe ukuphazamiseka okuncane nokuthuthukisa ukusebenza.

2

3. Ngokusekelwe ezidingweni zokuphatha okushisayo, ukupakisha okuncanyana kubalulekile. Ukusebenza kwe-CPU kuthinta ngqo ukusebenza kukonke kwekhompyutha. Isinyathelo sokugcina nesibucayi kakhulu ekwenziweni kwe-CPU ubuchwepheshe bokupakisha. Amasu okupakisha ahlukene angabangela umehluko omkhulu wokusebenza kuma-CPU. Ubuchwepheshe bokupakisha bekhwalithi ephezulu kuphela obungakhiqiza imikhiqizo ye-IC ephelele.

4. Ku-RF communication baseband ICs, amamodemu asetshenziswa ekuxhumaneni afana namamodemu asetshenziselwa ukufinyelela i-inthanethi kumakhompyutha.


Isikhathi sokuthumela: Nov-18-2024