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Izindaba Zemboni: Ukusungula Izinto Zokupakisha Ze-Samsung Ezisebenzisa Ama-Semiconductor: Ingabe Kushintsha Umdlalo?

Izindaba Zemboni: Ukusungula Izinto Zokupakisha Ze-Samsung Ezisebenzisa Ama-Semiconductor: Ingabe Kushintsha Umdlalo?

Uphiko lwe-Samsung Electronics' Device Solutions lusheshisa ukuthuthukiswa kwezinto ezintsha zokupakisha ezibizwa ngokuthi "i-glass interposer", okulindeleke ukuthi zithathe indawo ye-silicon interposer ebiza kakhulu. I-Samsung ithole iziphakamiso ezivela ku-Chemtronics and Philoptics zokuthuthukisa lobu buchwepheshe kusetshenziswa i-Corning glass futhi ihlola ngenkuthalo amathuba okubambisana ukuze ithengiswe.

Okwamanje, i-Samsung Electro - Mechanics nayo ithuthukisa ucwaningo kanye nentuthuko yamabhodi okuthwala ingilazi, ihlela ukufeza ukukhiqizwa ngobuningi ngo-2027. Uma kuqhathaniswa nama-interposer e-silicon avamile, ama-interposer engilazi awagcini nje ngokuba nezindleko eziphansi kodwa futhi anokuqina kokushisa okuhle kakhulu kanye nokumelana nokuzamazama komhlaba, okungenza inqubo yokukhiqiza ye-micro-circuit ibe lula ngempumelelo.

Embonini yezinto zokupakisha ze-elekthronikhi, lokhu kusungula izinto ezintsha kungaletha amathuba nezinselele ezintsha. Inkampani yethu izoqapha ngokucophelela lezi ntuthuko zobuchwepheshe futhi ilwele ukuthuthukisa izinto zokupakisha ezingahambisana kangcono nezitayela ezintsha zokupakisha ze-semiconductor, iqinisekise ukuthi amateyipu ethu okuphatha, amateyipu okumboza, nama-reels kunganikeza isivikelo esithembekile kanye nokusekelwa kwemikhiqizo ye-semiconductor yesizukulwane esisha.

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Isikhathi sokuthunyelwe: Feb-10-2025