Isigaba se-Samsung Electronics' Device Solutions sisheshisa ukuthuthukiswa kwendawo entsha yokupakisha ebizwa ngokuthi "glass interposer", okulindeleke ukuthi ithathe indawo ye-silicon interposer ebiza kakhulu. AbakwaSamsung bathole iziphakamiso ezivela kwaChemtronics kanye nePhiloptics zokuthuthukisa lobu buchwepheshe kusetshenziswa ingilazi yeCorning futhi ihlola ngenkuthalo amathuba okusebenzisana ukuze kudayiswe.
Phakathi naleso sikhathi, i-Samsung Electro - Mechanics iphinde ithuthukise ucwaningo nokuthuthukiswa kwamabhodi okuphatha ingilazi, ihlela ukufeza ukukhiqizwa okukhulu ngo-2027. Uma kuqhathaniswa nezithameli ze-silicon zendabuko, izithameli zeglasi azigcini nje ngokuba nezindleko eziphansi kodwa futhi ziphethe ukuzinza okuhle kakhulu kokushisa nokumelana nokuzamazama komhlaba, okungenza kube lula ngempumelelo inqubo yokukhiqiza isekethe encane.
Embonini yezinto zokupakisha ze-elekthronikhi, lokhu kuqanjwa kungase kulethe amathuba amasha nezinselele. Inkampani yethu izoyiqapha ngokucophelela le ntuthuko yezobuchwepheshe futhi ilwele ukuthuthukisa izinto zokupakisha ezingafanelana kangcono namathrendi amasha okupakisha ama-semiconductor, iqinisekise ukuthi amakhasethi ethu okuthwala, amakhava, namareli anganikeza ukuvikeleka okuthembekile nokusekelwa kwemikhiqizo yesizukulwane esisha se-semiconductor.
Isikhathi sokuthumela: Feb-10-2025