Izindaba Zezimboni: Ukusungulwa kwe-Samsung ku-Semiconductor Packaging Material: Changer Game?

I-Samsung Electronics's Solutions Division Division isheshisa ukuthuthukiswa kwezinto ezintsha zokupakisha ezibizwa nge- "Glass Interbaser", okulindeleke ukuthi zithathe indawo ye-High - Cost Silicon InterPoSser. AbakwaSamsung bathole iziphakamiso ezivela kuma-chemics nama-philoptics ukuthuthukisa lobu buchwepheshe besebenzisa i-Corning Glass futhi kuhlaziya ngenkuthalo amathuba okuhweba kwawo.

Ngaleso sikhathi, i-Samsung Electro - I-Mechanics nayo iqhubekela phambili ucwaningo kanye nokuthuthukiswa kwamabhodi we-Carriers we-Glass, ukuhlela ukufezekisa ukukhiqizwa kwendabuko ngo-2027

Ngokwezimboni ze-elekthronikhi zokupakisha, lokhu okusha kungaletha amathuba nezinselelo ezintsha. Inkampani yethu izobhekisisa lokhu intuthuko yezobuchwepheshe futhi ilwele ukuthuthukisa izinto zokupakisha ezingahambelana kangcono nezitayela ezintsha ze-semiconductor, ukuqinisekisa ukuthi amateyipu wenkampani athwala, futhi ama-reels anganikeza ukuvikelwa okuthembekile kanye nokusekelwa kwemikhiqizo ye-semiconductor entsha.