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Izindaba Zemboni: I-ASML's New Lithography Technology kanye Nomthelela Wayo ku-Semiconductor Packaging

Izindaba Zemboni: I-ASML's New Lithography Technology kanye Nomthelela Wayo ku-Semiconductor Packaging

I-ASML, umholi womhlaba jikelele ezinhlelweni ze-semiconductor lithography, isanda kumemezela ukuthuthukiswa kobuchwepheshe obusha be-ultraviolet (EUV) obusha bokubhala. Lobu buchwepheshe kulindeleke ukuthi buthuthukise kakhulu ukunemba kokukhiqizwa kwe-semiconductor, buvumele ukukhiqizwa kwama-chips anezici ezincane nokusebenza okuphezulu.

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Uhlelo olusha lwe-EUV lithography lungafinyelela ukulungiswa okungafika ku-1.5 nanometers, intuthuko enkulu ngaphezu kwesizukulwane samanje samathuluzi e-lithography. Lokhu kunemba okuthuthukisiwe kuzoba nomthelela omkhulu ezintweni zokupakisha ze-semiconductor. Njengoba ama-chips eba mancane futhi ayinkimbinkimbi ngokwengeziwe, isidingo samateyipu esithwali anembe kakhulu, amakhava, namareli ukuze kuqinisekiswe ukuthuthwa okuphephile nokugcinwa kwalezi zingxenye ezincane kuzokhula.

Inkampani yethu izibophezele ekulandeleni eduze lokhu kuthuthuka kwezobuchwepheshe embonini ye-semiconductor. Sizoqhubeka nokutshala imali ocwaningweni nasekuthuthukisweni ukuze sithuthukise izinto zokupakisha ezingahlangabezana nezidingo ezintsha ezilethwa ubuchwepheshe obusha be-ASML be-lithography, obuhlinzeka ngosekelo oluthembekile lwenqubo yokukhiqiza i-semiconductor.


Isikhathi sokuthumela: Feb-17-2025