NgoSepthemba 13, 2024, iResonac yamemezela ukwakhiwa kwesakhiwo esisha sokukhiqiza sama-SiC (i-silicon carbide) ama-wafers kagesi e-Yamagata Plant e-Higashine City, Yamagata Prefecture. Ukuphothulwa kulindeleke engxenyeni yesithathu ka-2025.
Isikhungo esisha sizotholakala ngaphakathi kwe-Yamagata Plant yenkampani engaphansi kwayo, i-Resonac Hard Disk, futhi sizoba nendawo yokwakha engu-5,832 square metres. Izokhiqiza ama-wafers e-SiC (ama-substrates kanye ne-epitaxy). NgoJuni 2023, i-Resonac yathola isitifiketi kuMnyango Wezomnotho, Wezohwebo Nezimboni njengengxenye yohlelo lokuqinisekisa ukuhlinzekwa kwezinto ezibalulekile ezibekwe ngaphansi koMthetho Wokukhuthaza Ukuvikeleka Komnotho, ikakhulukazi izinto zokwakha ze-semiconductor (ama-wafers e-SiC). Uhlelo lokuqinisekisa ukuhlinzekwa kwempahla olugunyazwe uMnyango Wezomnotho, Uhwebo Nezimboni ludinga ukutshalwa kwezimali kwezigidigidi ezingama-30.9 zamayen ukuze kuqiniswe umthamo wokukhiqiza we-SiC wafer ezisekelweni eziseDolobheni lase-Oyama, esifundeni sase-Tochigi; Hikone City, Shiga Prefecture; Higashine City, Yamagata Prefecture; kanye neDolobha lase-Ichihara, eSifundazweni saseChiba, ngoxhaso olufika kuma-yen ayizigidi eziyizinkulungwane ezingu-10.3.
Uhlelo luwukuqala ukuhlinzeka ngamawafa e-SiC (ama-substrates) e-Oyama City, e-Hikone City, nase-Higashine City ngo-April 2027, ngomthamo wonyaka wokukhiqiza wezingcezu eziyi-117,000 (okulingana nama-intshi angu-6). Ukuhlinzekwa kwama-wafers e-SiC epitaxial e-Ichihara City nase-Higashine City kuhlelwe ukuthi kuqale ngoMeyi 2027, okulindelwe umthamo wonyaka wezingcezu ezingu-288,000 (angashintshiwe).
NgoSepthemba 12, 2024, inkampani yabamba umcimbi omkhulu endaweni okuhleliwe yokwakha e-Yamagata Plant.
Isikhathi sokuthumela: Sep-16-2024