NgoSepthemba 13, 2024, i-Resonac imemezele ukwakhiwa kwesakhiwo esisha sokukhiqiza se-SIC (Silicon Carbide) ama-wafeonductor kuma-semiconductors asosisekelo sayo se-Yamagata eHigashine City, i-Yamagata Prefecture. Ukuqedwa kulindeleke kwikota yesithathu ka-2025.
Lesi sikhungo esisha sizotholakala ngaphakathi kwesitshalo se-Yamagata se-suppsier yaso, i-resonac hard disk, futhi sizoba nendawo yokwakha amamitha-skwele angama-5,832. Kuzokhiqiza ama-sic wafers (ama-substrates kanye ne-epitaxy). NgoJuni 2023, uSurenonac uthole isitifiketi esivela eMnyangweni Wezomnotho, ukuhweba kanye nomkhakha njengengxenye yohlelo lokuqinisekiswa lokuhlinzekwa kwezidingo zezinto ezibalulekile eziqokiwe ngaphansi koMthetho Wokukhuthaza Ezokuphepha Kwezomnotho, ngokuqondile izinto ze-semiconductor (ama-wefers we-sic). Uhlelo lokuqinisekisa ukuhlinzeka ngokuhlinzekwa okuvunyelwe yinkonzo yezomnotho, ukuhweba kanye nemboni kudinga ukutshalwa kwemali kwe-yen engama-30,9 billion ukuqinisa amandla okukhiqiza a-sic wafer ezisekelweni e-Oyama City, eTochigi; Hikone City, Shiga Prefecture; IHigashine City, i-Yamagata Prefecture; kanye ne-Ichihara City, iChiba Prefecture, enoxhaso olungaphezulu kwezigidi eziyizinkulungwane eziyi-10,3.
Uhlelo ukuqala ukuhlinzeka ngama-sic weafers (ama-substrates) ku-Oyama City, i-hikone City, neHigashine City ngo-Ephreli 2027, ngamandla onke wokukhiqiza wezingcezu eziyi-117,000 (ezilingana nama-intshi ayi-6). Ukuhlinzekwa kwe-Sic Epitaxial Wafers ku-Ichihara City kanye neHigashine City kulindeleke ukuthi kuqale ngoMeyi 2027, kube nekhono elilindelekile lonyaka lezingcezu ezingama-288,000 (ezingashintshiwe).
NgoSepthemba 12, 2024, inkampani yabamba umcimbi oyisisekelo endaweni yokwakha ehleliwe esiteshini saseYamagata.
Isikhathi sePosi: Sep-16-2024