Izindaba Zemboni: I-GPU inyusa isidingo sama-wafer e-silicon

I-Silicon iyinto yesibili evame kakhulu eMhlabeni, ngemuva kwe-oxygen, futhi ingeyesikhombisa evame kakhulu endaweni yonke. I-Silicon iyi-semiconductor, okusho ukuthi inezakhiwo zikagesi phakathi kwama-conductor (njengethusi) kanye nama-insulator (njengengilazi). Inani elincane lama-athomu angaphandle esakhiweni se-silicon lingashintsha ngokuyisisekelo ukuziphatha kwayo, ngakho-ke ubumsulwa be-silicon ye-semiconductor-grade kumele bube phezulu ngokumangalisayo. Ubumsulwa obuncane obamukelekayo be-silicon ye-electronic-grade bungu-99.999999%.

Lokhu kusho ukuthi kuvunyelwe i-athomu eyodwa kuphela engeyona i-silicon kuma-athomu ayizigidi eziyishumi. Amanzi okuphuza amahle avumela ama-molecule angewona amanzi ayizigidi ezingu-40, okumsulwa ngokuphindwe izikhathi ezingu-50 kune-silicon yezinga le-semiconductor.

Abakhiqizi be-silicon wafer engenalutho kumele baguqule i-silicon emsulwa kakhulu ibe yizakhiwo eziphelele ze-single-crystal. Lokhu kwenziwa ngokufaka i-single mother crystal ibe yi-silicon encibilikisiwe ekushiseni okufanele. Njengoba amakristalu amasha endodakazi eqala ukukhula ezungeze i-mother crystal, i-silicon ingot yakheka kancane kancane kusuka ku-silicon encibilikisiwe. Inqubo ihamba kancane futhi ingathatha isonto. I-silicon ingot eqediwe inesisindo esingamakhilogremu ayi-100 futhi ingenza ama-wafer angaphezu kuka-3,000.

Ama-wafer asikwa abe yizicucu ezincane kusetshenziswa ucingo lwedayimane oluncane kakhulu. Ukunemba kwamathuluzi okusika i-silicon kuphezulu kakhulu, futhi abaqhubi kumele baqashwe njalo, noma bazoqala ukusebenzisa amathuluzi ukwenza izinto eziwubuwula ezinweleni zabo. Isingeniso esifushane sokukhiqizwa kwama-wafer e-silicon silula kakhulu futhi asinikezi ngokugcwele iminikelo yabahlakaniphile; kodwa kunethemba lokuthi sizonikeza isizinda sokuqonda okujulile ibhizinisi le-wafer ye-silicon.

Ubudlelwano bokunikezwa kanye nesidingo sama-wafer e-silicon

Imakethe ye-silicon wafer iphethwe yizinkampani ezine. Sekuyisikhathi eside imakethe isesimweni esibucayi phakathi kokunikezwa kanye nesidingo.
Ukwehla kokuthengiswa kwama-semiconductor ngo-2023 kuholele ekutheni imakethe ibe sesimweni sokwanda ngokweqile, okubangele ukuthi izinqolobane zangaphakathi nezangaphandle zabakhiqizi bama-chip zibe phezulu. Kodwa-ke, lesi yisimo sesikhashana nje. Njengoba imakethe ilulama, imboni izobuyela maduze emkhawulweni womthamo futhi kumele ihlangabezane nesidingo esengeziwe esilethwe yinguquko ye-AI. Ukuguquka kusuka ekwakhiweni kwendabuko okusekelwe ku-CPU kuya ekubenila okusheshayo kuzoba nomthelela kuyo yonke imboni, njengoba Nokho, lokhu kungaba nomthelela ezingxenyeni zenani eliphansi zemboni ye-semiconductor.

Izakhiwo ze-Graphics Processing Unit (GPU) zidinga indawo eyengeziwe ye-silicon

Njengoba isidingo sokusebenza sanda, abakhiqizi be-GPU kumele banqobe eminye imikhawulo yokuklama ukuze bafinyelele ukusebenza okuphezulu okuvela kuma-GPU. Ngokusobala, ukwenza i-chip ibe nkulu kuyindlela eyodwa yokufinyelela ukusebenza okuphezulu, njengoba ama-electron engathandi ukuhamba amabanga amade phakathi kwama-chip ahlukene, okunciphisa ukusebenza. Kodwa-ke, kunomkhawulo osebenzayo wokwenza i-chip ibe nkulu, owaziwa ngokuthi "umkhawulo we-retina".

Umkhawulo we-lithography ubhekisela kusayizi omkhulu we-chip ongadalulwa ngesinyathelo esisodwa emshinini we-lithography osetshenziswa ekukhiqizweni kwe-semiconductor. Lo mkhawulo unqunywa usayizi omkhulu wensimu yamagnetic yemishini ye-lithography, ikakhulukazi i-stepper noma i-scanner esetshenziswa enkambisweni ye-lithography. Ngobuchwepheshe bamuva, umkhawulo wemaski uvame ukuba cishe ngamamilimitha-skwele angu-858. Lo mkhawulo wosayizi ubaluleke kakhulu ngoba unquma indawo ephezulu engadwetshwa ku-wafer ekubonakalisweni okukodwa. Uma i-wafer inkulu kunalo mkhawulo, kuzodingeka ukuvezwa okuningi ukuze kudwetshwe ngokuphelele i-wafer, okuyinto engenakwenzeka ekukhiqizweni okukhulu ngenxa yezinselele zobunzima nokuqondanisa. I-GB200 entsha izonqoba lo mkhawulo ngokuhlanganisa ama-substrate amabili e-chip anemikhawulo yosayizi wezinhlayiya ku-silicon interlayer, yakhe i-substrate elinganiselwe kakhulu yezinhlayiya ephindwe kabili. Eminye imikhawulo yokusebenza inani lememori kanye nebanga kuleyo memori (okungukuthi i-bandwidth yememori). Izakhiwo ezintsha ze-GPU zinqoba le nkinga ngokusebenzisa imemori ye-bandwidth ephezulu ehlanganisiwe (i-HBM) efakwe ku-interposer efanayo ye-silicon enama-chip amabili e-GPU. Ngokombono we-silicon, inkinga nge-HBM ukuthi ingxenye ngayinye yendawo ye-silicon iphindwe kabili kune-DRAM yendabuko ngenxa yesikhombimsebenzisi esihambisanayo esidingekayo ukuze kube nomkhawulokudonsa ophezulu. I-HBM iphinde ihlanganise i-chip yokulawula i-logic esitokisini ngasinye, okwandisa indawo ye-silicon. Ukubala okulinganiselwe kukhombisa ukuthi indawo ye-silicon esetshenziswa kusakhiwo se-2.5D GPU iphindwe izikhathi ezingu-2.5 kuya kwezingu-3 kunesakhiwo se-2.0D sendabuko. Njengoba kushiwo ngaphambili, ngaphandle kokuthi izinkampani zokwenziwa kwensimbi zilungele lolu shintsho, umthamo we-silicon wafer ungase uqine kakhulu futhi.

Amandla esikhathi esizayo emakethe ye-silicon wafer

Umthetho wokuqala kwemithathu yokukhiqiza ama-semiconductor ukuthi imali eningi idinga ukutshalwa uma imali encane kakhulu ikhona. Lokhu kungenxa yemvelo yokujikeleza kwemboni, futhi izinkampani zama-semiconductor zinobunzima bokulandela lo mthetho. Njengoba kuboniswe esithombeni, abakhiqizi abaningi be-silicon wafer baye baqaphela umthelela walolu shintsho futhi bacishe baphinde kathathu izindleko zabo zekota eziphelele kumakota ambalwa edlule. Naphezu kwezimo zemakethe ezinzima, lokhu kusenjalo. Okuthakazelisa nakakhulu ukuthi lo mkhuba ubulokhu uqhubeka isikhathi eside. Izinkampani ze-silicon wafer zinenhlanhla noma ziyazi okuthile abanye abangazazi. I-sequence supply chain ingumshini wesikhathi ongabikezela ikusasa. Ikusasa lakho lingase libe yisikhathi somunye umuntu. Nakuba singatholi njalo izimpendulo, cishe njalo sithola imibuzo ewusizo.