Izindaba Zezimboni: I-GPU ishayela isidingo se-Silicon Wafers

ISilicon yinto yesibili evamile emhlabeni, ngemuva komoya-mpilo, nemininingwane yesikhombisa evamile kakhulu endaweni yonke. I-Silicon yi-semiconductor, okusho ukuthi inezindawo zikagesi phakathi kwabaqhubi (njengethusi) kanye nabathakathi (njengengilazi). Inani elincane lama-athomu akwamanye amazwe ekwakhiweni kwe-silicon lingashintsha ngokuyisisekelo sokuziphatha kwalo, ngakho-ke ubumsulwa be-semiconductor-grade-grade silicon kumele bube phezulu ngokumangazayo. Ubumsulwa obungamukeleki obungamukelekayo we-silicon ebangeni le-elekthronikhi nge-99.99999%.

Lokhu kusho ukuthi i-athomu elilodwa le-non-salicon elivunyelwe kuwo wonke ama-athomu ayizigidi eziyishumi. Amanzi amahle okuphuza avumela ama-molekyuli angama-40 angewona amanzi, okuyizikhathi eziyizigidi ezingama-50 ezingahlanzekile kune-semiconductor-grade.

Abakhiqizi be-silicon wafer abangenalutho kumele baguqule i-silico ebumsulwa ephezulu ibe yizinhlaka eziphelele zekristali. Lokhu kwenziwa ngokungenisa i-crystal yomama eyodwa ibe yi-silicon ebiwe emazingeni okushisa afanele. Njengoba amakristalu endodakazi entsha eqala ukukhula ezungeze i-crystal mama, i-silicon ingot yakha kancane kusuka ku-silicon ebilisiwe. Inqubo ihamba kancane futhi ingathatha isonto. I-silicon ingot eqediwe inesisindo esingamakhilogremu ayi-100 futhi ingenza ama-wafers angaphezu kuka-3,000.

Ama-Wafers anqunywa abe izingcezu ezincanyana asebenzisa ucingo oluhle kakhulu lwedayimane. Ukunemba kwamathuluzi okusika i-silicon kuphakeme kakhulu, futhi abaqhubi kumele babhekwe njalo, noma bazoqala ukusebenzisa amathuluzi okwenza izinto eziyiziwula ezinweleni zabo. Ukwethulwa okufushane kokukhiqizwa kwe-Silicon Wafers kwenziwe lula kakhulu futhi akusho lutho ngokugcwele iminikelo ye-genius; Kepha kuthengwa ukuhlinzeka ngesizinda sokuqonda okujulile kwebhizinisi le-silicon wafer.

Ukuhlinzekwa kanye nokufuna ubudlelwano be-Silicon Wafers

Imakethe yeSilico wafer iphethwe yizinkampani ezine. Isikhathi eside, imakethe ibisemakethenteke kakhulu phakathi kokunikezwa kanye nokufunwa.
Ukwehla kokuthengiswa kwe-semiconductor ngo-2023 kuholele emakethe ukuba sesimweni sokusebenzisa ngokweqile, okubangela ukusungulwa kwabakhiqizi be-chip abakhiqizi be-chip. Kodwa-ke, lesi yisimo sesikhashana nje. Njengoba imakethe ilulama, imboni izobuyela emaphethelweni amandla futhi kufanele ihlangabezane nesidingo esingeziwe esilethwe yi-AI Revolution. Ukushintshwa kusuka kuzakhiwo ze-CPU ezenziwa yi-CPU kuya kwikhompiyutha esheshayo kuzoba nomthelela kulo lonke imboni, kungakabikho, lokhu kungaba nomthelela ezingxenyeni eziphansi zemboni ye-semiconductor.

I-Graphics Processing Unit (GPU) izakhiwo zokwakha zidinga indawo engaphezulu ye-silicon

Njengoba ukufunwa kokusebenza kukhuphuka, abakhiqizi be-GPU kumele banqobe eminye imikhawulo yokuklama ukuze bafeze ukusebenza okuphezulu kusuka ku-GPUS. Ngokusobala, ukwenza i-chip enkulu kungenye indlela yokuthola ukusebenza okuphezulu, njengoba ama-elektroni awathandi ukuhamba amabanga amade phakathi kwama-chips ahlukene, anciphisa ukusebenza. Kodwa-ke, kunomkhawulo osebenzayo wokwenza i-chip enkulu, eyaziwa ngokuthi i- "retina umkhawulo".

Umkhawulo we-Lithography ubhekisele kusayizi omkhulu we-chip ongavezwa esinyathelweni esisodwa emshinini we-lethophs esetshenziswa ekukhiqizweni kwe-semiconductor. Lokhu kukhawulelwa kunqunywa ngosayizi omkhulu wensimu ye-lithography, ikakhulukazi i-stepper noma isithwebuli esisetshenziswa kwinqubo ye-lithography. Okwezobuchwepheshe bamuva, umkhawulo we-mask uvame ukuvame ukuba phakathi kwamamilimitha ayisikwele angama-858. Lo mkhawulo wesayizi ubaluleke kakhulu ngoba inquma indawo ephezulu engahle ibekwe eceleni kokuvezwa okukodwa. Uma ngabe i-wafer inkulu kunale mkhawulo, ukuvezwa okuningi kuzodingeka ukulinganisa ngokuphelele i-wafer, okungenzeka ukuthi ukukhiqizwa kwenqwaba ngenxa yezinselelo zokubumbana nokuqondanisa. I-GB200 entsha izonqoba lokhu kukhawulelwa ngokuhlanganisa ama-substates amabili we-chip ngokulinganiselwa kosayizi wezinhlayiyana ku-Silicon interlayer, ebeka isisekelo esilinganiselwe esilinganiselwe esiphindwe kabili. Eminye imikhawulo yokusebenza inani lememori kanye nebanga le-Memory (IE Memory Bandwidth). I-New GPU Archites inqoba le nkinga ngokusebenzisa inkumbulo ehlanganisiwe ye-bandwidth (HBM) efakwe kwi-SiliconTser efanayo enama-chip amabili we-GPU. Ngokombono we-silicon, inkinga nge-HBM ukuthi kancane indawo ngayinye ye-silicon iyiphindwe kabili ye-dram yendabuko ngenxa yesimo esibonakalayo esiphakeme esidingekayo kwi-bandwidth ephezulu. I-HBM ibuye ihlanganise i-chip control chip enengqondo ibe isitaki ngasinye, yandisa indawo ye-silicon. Ukubala okunzima kukhombisa ukuthi indawo ye-silicon esetshenziswe ku-2.5D GPU Architecture iyi-2,5 kuye kwezingu-3 ezokwakha ingqikithi yendabuko. Njengoba kushiwo ngaphambili, ngaphandle kokuthi izinkampani zakwa-Fembutho zilungiselelwe lolu shintsho, umthamo we-silicon wafer ungaphinde uqine.

Amandla wesikhathi esizayo eMakethe yeSilicon wafer

Eyokuqala yale mithetho emithathu yokukhiqiza i-semiconductor ukuthi imali eningi idinga ukutshalwa kwemali lapho inani elincane lemali liyatholakala. Lokhu kungenxa yemvelo yasemkhakheni, nezinkampani ze-semiconductor zinesikhathi esinzima ukulandela lo mthetho. Njengoba kukhonjisiwe kwisibalo, abakhiqizi abaningi be-Silicon Wafer babone umthelela walolu shintsho futhi bacishe baphindaphinde izindleko zabo eziphelele zekota ezindaweni ezimbalwa ezedlule. Naphezu kwezimo ezinzima zemakethe, kunjalo kunjalo. Okuthakazelisa ngokwengeziwe ukuthi le ndlela ibilokhu iqhubeka isikhathi eside. Izinkampani ze-Silicon Wafer zinenhlanhla noma zazi okuthile okungekhona abanye. I-semiconductor Supply Chain ngumshini wesikhathi ongabikezela ikusasa. Ikusasa lakho lingaba yisikhathi somunye umuntu. Ngenkathi asihlali sithola izimpendulo, cishe ngaso sonke isikhathi sithola imibuzo efanelekile.