Ukupakishwa kwe-semiconductor kushintshe kusukela ekwakhiweni kwe-PCB yendabuko ye-1D kuya ekuhlanganisweni kwe-3D hybrid okusezingeni eliphezulu ezingeni le-wafer. Lokhu kuthuthuka kuvumela isikhala sokuxhumanisa ebangeni le-micron yenombolo eyodwa, ngama-bandwidth afinyelela ku-1000 GB/s, ngenkathi kugcinwa ukusebenza kahle kwamandla okuphezulu. Okubalulekile kobuchwepheshe obuthuthukisiwe bokupakisha be-semiconductor ukupakishwa kwe-2.5D (lapho izingxenye zibekwa eceleni kwesendlalelo esiphakathi) kanye nokupakishwa kwe-3D (okubandakanya ukufaka ama-chip asebenzayo ngokuqondile). Lobu buchwepheshe bubalulekile ekusaseni lezinhlelo ze-HPC.
Ubuchwepheshe bokupakisha be-2.5D buhilela izinto ezahlukahlukene zesendlalelo esiphakathi, ngasinye sinezinzuzo nezinkinga zaso. Izendlalelo ze-silicon (Si), okuhlanganisa ama-wafer e-silicon angasebenzi ngokuphelele kanye namabhuloho e-silicon asendaweni, zaziwa ngokuhlinzeka ngamakhono amahle kakhulu okuxhuma izintambo, okwenza zibe zilungele ukubala okuphezulu. Kodwa-ke, ziyabiza ngokwezinto zokwakha kanye nokukhiqiza futhi zibhekene nemikhawulo endaweni yokupakisha. Ukuze kuncishiswe lezi zinkinga, ukusetshenziswa kwamabhuloho e-silicon asendaweni kuyanda, kusetshenziswa i-silicon ngendlela efanele lapho ukusebenza kahle kubalulekile ngenkathi kuxazululwa imikhawulo yendawo.
Izendlalelo ze-organic intermediary, ezisebenzisa amapulasitiki abunjiwe aphuma ku-fan, ziyindlela engcono kakhulu kune-silicon. Zine-dielectric constant ephansi, okunciphisa ukubambezeleka kwe-RC ephaketheni. Naphezu kwalezi zinzuzo, izendlalelo ze-organic intermediary ziyazabalaza ukufeza izinga elifanayo lokunciphisa izici zokuxhumanisa njengokupakisha okusekelwe ku-silicon, okunciphisa ukwamukelwa kwazo ezinhlelweni zokusebenza zekhompyutha ezisebenzayo kakhulu.
Izendlalelo ze-glass intermediary zithole isithakazelo esikhulu, ikakhulukazi ngemuva kokwethulwa kwe-Intel kwakamuva kokupakisha izimoto zokuhlola ezisekelwe engilazini. I-Glass inikeza izinzuzo eziningana, njenge-adjustable coefficient of thermal expansion (CTE), ukuzinza okuphezulu, izindawo ezibushelelezi nezisicaba, kanye nekhono lokusekela ukukhiqizwa kwamaphaneli, okwenza kube yinto ethembisayo yezendlalelo ze-intermediary ezinamakhono okuxhuma izintambo afana ne-silicon. Kodwa-ke, ngaphandle kwezinselele zobuchwepheshe, inkinga enkulu yezendlalelo ze-glass intermediary i-ecosystem engavuthiwe kanye nokuntuleka kwamanje kwamandla okukhiqiza amakhulu. Njengoba i-ecosystem ivuthwa futhi amakhono okukhiqiza ethuthuka, ubuchwepheshe obusekelwe engilazini ekupakisheni kwe-semiconductor bungabona ukukhula nokusetshenziswa okwengeziwe.
Ngokuphathelene nobuchwepheshe bokupakisha be-3D, i-Cu-Cu bump-less hybrid bonding isiba ubuchwepheshe obusha obuhamba phambili. Le ndlela ethuthukisiwe ifinyelela ukuxhumana okuhlala njalo ngokuhlanganisa izinto ze-dielectric (njenge-SiO2) nezinsimbi ezifakiwe (i-Cu). I-Cu-Cu hybrid bonding ingafinyelela izikhala ezingaphansi kwama-micron ayi-10, ngokuvamile ebangeni le-micron yedijithi elilodwa, okumelela intuthuko enkulu kunobuchwepheshe bendabuko be-micro-bump, obunezikhala ze-bump ezingaba ngu-40-50 microns. Izinzuzo ze-hybrid bonding zifaka phakathi i-I/O eyandisiwe, i-bandwidth ethuthukisiwe, i-3D vertical stacking ethuthukisiwe, ukusebenza kahle kwamandla okungcono, kanye nemiphumela encishisiwe ye-parasitic kanye nokumelana nokushisa ngenxa yokungabikho kokugcwalisa phansi. Kodwa-ke, lobu buchwepheshe buyinkimbinkimbi ukubukhiqiza futhi bunezindleko eziphakeme.
Ubuchwepheshe bokupakisha be-2.5D kanye ne-3D buhlanganisa amasu ahlukahlukene okupakisha. Ekupakisheni kwe-2.5D, kuye ngokuthi kukhethwa kanjani izinto zesendlalelo esiphakathi, kungahlukaniswa ngezigaba zezendlalelo ezisekelwe ku-silicon, ezisekelwe ku-organic, kanye nezendlalelo ezisekelwe ku-glass, njengoba kuboniswe esithombeni esingenhla. Ekupakisheni kwe-3D, ukuthuthukiswa kobuchwepheshe be-micro-bump kuhlose ukunciphisa ubukhulu besikhala, kodwa namuhla, ngokusebenzisa ubuchwepheshe bokubopha obuhlanganisiwe (indlela yokuxhuma eqondile ye-Cu-Cu), ubukhulu besikhala senombolo eyodwa bungatholakala, okubonisa intuthuko enkulu ensimini.
**Izitayela Eziyinhloko Zobuchwepheshe Okufanele Uzibuke:**
1. **Izindawo Ezinkulu Zezingqimba Eziphakathi:** I-IDTechEx yabikezela ngaphambilini ukuthi ngenxa yobunzima bezingqimba eziphakathi ze-silicon ezidlula umkhawulo wosayizi we-reticle ongu-3x, izixazululo ze-silicon bridge ezingu-2.5D zizothatha indawo yezingqimba eziphakathi ze-silicon ngokushesha njengokukhetha okuyinhloko kokupakisha ama-chip e-HPC. I-TSMC ingumhlinzeki omkhulu wezingqimba eziphakathi ze-silicon ezingu-2.5D ze-NVIDIA kanye nabanye abathuthukisi be-HPC abaphambili njenge-Google ne-Amazon, futhi inkampani isanda kumemezela ukukhiqizwa okukhulu kwe-CoWoS_L yayo yesizukulwane sokuqala enosayizi we-reticle ongu-3.5x. I-IDTechEx ilindele ukuthi lo mkhuba uqhubeke, ngentuthuko eyengeziwe exoxwe ngayo embikweni wayo ehlanganisa abadlali abakhulu.
2. **Ukupakishwa Kwezinga Lephaneli:** Ukupakishwa kwezinga lephaneli sekuyinto ebalulekile, njengoba kuqokonyiswe eMbukisweni We-Semiconductor Wezizwe Zonke waseTaiwan ka-2024. Le ndlela yokupakishwa ivumela ukusetshenziswa kwezingqimba ezinkulu zomxhumanisi futhi isiza ukunciphisa izindleko ngokukhiqiza amaphakheji amaningi ngasikhathi sinye. Naphezu kwamandla ayo, izinselele ezifana nokuphathwa kwe-warpage kusadingeka kubhekwane nazo. Ukuvelela kwayo okwandayo kubonisa isidingo esikhulayo sezingqimba ezinkulu nezingabizi kakhulu zomxhumanisi.
3. **Izendlalelo Zokuxhumanisa Ngengilazi:** Ingilazi ivela njengento eqinile yokufeza izintambo ezincane, ezifana ne-silicon, enezinzuzo ezengeziwe njenge-CTE elungisekayo kanye nokuthembeka okuphezulu. Izendlalelo zokuxhumanisa ngengilazi nazo ziyahambisana nokupakishwa kwezinga lephaneli, okunikeza amandla okuxhumanisa ngezintambo eziphezulu ngezindleko ezilawulekayo, okwenza kube yisisombululo esithembisayo sobuchwepheshe bokupakisha besikhathi esizayo.
4. **I-HBM Hybrid Bonding:** I-3D copper-copper bonding (Cu-Cu) hybrid bonding iwubuchwepheshe obubalulekile bokufeza ukuxhumana okuqondile kwe-ultra-fine pitch phakathi kwama-chips. Lobu buchwepheshe busetshenziswe emikhiqizweni ehlukahlukene yeseva ephezulu, kufaka phakathi i-AMD EPYC yama-stacked SRAM nama-CPU, kanye nochungechunge lwe-MI300 lokufaka amabhlogo e-CPU/GPU kuma-I/O dies. I-hybrid bonding kulindeleke ukuthi idlale indima ebalulekile ekuthuthukisweni kwe-HBM esikhathini esizayo, ikakhulukazi kuma-DRAM stacks adlula izingqimba ze-16-Hi noma ze-20-Hi.
5. **Amadivayisi Optical Ahlanganisiwe (i-CPO):** Njengoba isidingo sikhula sokusetshenziswa kwedatha ephezulu kanye nokusebenza kahle kwamandla, ubuchwepheshe bokuxhumana kwe-optical buye bazuza ukunakwa okukhulu. Amadivayisi optical ahlanganisiwe (i-CPO) aseba yisisombululo esiyinhloko sokuthuthukisa i-bandwidth ye-I/O kanye nokunciphisa ukusetshenziswa kwamandla. Uma kuqhathaniswa nokudluliselwa kukagesi okuvamile, ukuxhumana kwe-optical kunikeza izinzuzo eziningana, kufaka phakathi ukuncishiswa kwesignali okuphansi emabangeni amade, ukuzwela okuncishisiwe kokukhuluma, kanye ne-bandwidth ekhuphukile kakhulu. Lezi zinzuzo zenza i-CPO ibe yisinqumo esifanele sezinhlelo ze-HPC ezisebenzisa idatha kakhulu nezisebenzisa amandla kahle.
**Izimakethe Ezibalulekile Okufanele Uziqaphele:**
Imakethe eyinhloko eqhuba ukuthuthukiswa kobuchwepheshe bokupakisha be-2.5D kanye ne-3D ngokungangabazeki umkhakha we-high-performance computing (HPC). Lezi zindlela zokupakisha ezithuthukisiwe zibalulekile ekunqobeni imikhawulo yoMthetho kaMoore, okwenza kube lula ama-transistors amaningi, inkumbulo, kanye nokuxhumana ngaphakathi kwephakheji eyodwa. Ukuqhekeka kwama-chip kuvumela nokusetshenziswa kahle kwama-process node phakathi kwamabhulokhi ahlukene asebenzayo, njengokuhlukanisa amabhulokhi e-I/O kumabhulokhi okucubungula, okuthuthukisa ukusebenza kahle.
Ngaphezu kwekhompyutha esebenza kahle kakhulu (i-HPC), ezinye izimakethe kulindeleke ukuthi zikhule ngokusetshenziswa kobuchwepheshe bokupakisha obuthuthukisiwe. Emikhakheni ye-5G kanye ne-6G, izinto ezintsha ezifana nama-antenna okupakisha kanye nezixazululo ze-chip ezisezingeni eliphezulu zizokwakha ikusasa lezakhiwo zenethiwekhi yokufinyelela engenantambo (i-RAN). Izimoto ezizimele nazo zizozuza, njengoba lobu buchwepheshe busekela ukuhlanganiswa kwama-sensor suites nama-computing ukucubungula idatha eningi ngenkathi kuqinisekiswa ukuphepha, ukuthembeka, ukuqina, ukuphathwa kwamandla nokushisa, kanye nokusebenza kahle kwezindleko.
Ama-elekthronikhi abathengi (kufaka phakathi ama-smartphone, ama-smartwatches, amadivayisi e-AR/VR, ama-PC, kanye nezindawo zokusebenza) agxile kakhulu ekucubunguleni idatha eyengeziwe ezindaweni ezincane, naphezu kokugcizelela kakhulu izindleko. Ukupakisha kwe-semiconductor okuthuthukisiwe kuzodlala indima ebalulekile kulo mkhuba, yize izindlela zokupakisha zingase zihluke kulezo ezisetshenziswa ku-HPC.
Isikhathi sokuthunyelwe: Okthoba-07-2024