Ukupakishwa kwe-semicondector sekuvele kusuka kumiklamo ye-PCB yendabuko ye-1D ukunciphisa ubudlelwane be-3D hybrid e-adbrid ezingeni elihlanzi. Le ntuthuko ivumela ukuhlukaniswa kwesikhala kuhla lwemicron-digit micro, nge-bandwidths ezifika ku-1000 GB / S, ngenkathi zigcina ukusebenza kahle kwamandla. Emgogodleni we-Event CEMiconductor Packal Technologies yi-2.5D PackAging (lapho izakhi zibekwe eceleni kuseceleni olungaphakathi) kanye nokupakishwa kwe-3D (okubandakanya ama-chip asebenzayo). Lezi zibuchwepheshe zibalulekile ngekusasa lezinhlelo ze-HPC.
Ubuchwepheshe bokupakisha we-2.5D bubandakanya izinto ezahlukahlukene zesendlalelo eziphakathi, ngayinye enezinzuzo zayo nobunzima. I-Silicon (SI) Izendlalelo Ezithemuli, kufaka phakathi ama-silicon we-silicon aphelele namabhuloho we-silicon asendaweni, ayaziwa ngokuhlinzeka ngamakhono amahle kakhulu we-wiring, okwenza babe nekhono lokusebenza kahle kokusebenza. Kodwa-ke, zibiza kakhulu ngokwezinto zokwakha kanye nokwakha kanye nokubhekana nemikhawulo endaweni yokufaka. Ukunciphisa lezi zingqinamba, ukusetshenziswa kwamabhuloho e-silicon asendaweni kuyanda, ngokusebenzisa amasu asebenzisa i-silicon lapho ukusebenza okuhle kubalulekile ngenkathi kubhekwa khona izingqinamba zendawo.
Izendlalelo Zomphakathi We-Organic, zisebenzisa i-fastics enobumba yabathandi be-fan-Out, zingenye indlela ebiza kakhulu eSilicon. Bane-dielectric ephansi ephansi njalo, enciphisa ukubambezeleka kwe-RC kwiphakheji. Ngaphandle kwalezi zinzuzo, izingqimba eziphakathi eziphilayo zilwela ukufeza izinga elifanayo lokuncishiswa kwesici sokuxhumana njengokupakishwa okususelwa ku-silicon, kunciphisa ukutholwa kwalo ekusebenzeni kwekhompyutha okuphezulu.
Izendlalelo ezithemuli ze-Glass zithole inzalo enkulu, ikakhulukazi ukulandela ukwethulwa kwakamuva kwe-Intel kokuphakelwa kwe-Test Test Vehicled Grass. I-Glass inikeza izinzuzo eziningana, ezifana nezezimali eziguqukayo zokunwetshwa kwe-thermal (CTE), ukuqina okuphezulu, okubushelelezi kanye nekhono lokuxhasa ukukhiqiza amaphaneli, okwenza kube ngumuntu othembisayo wokukhiqiza, amakhono ahlukahlukene aqhathaniswa ne-silicon. Kodwa-ke, eceleni kwezinselelo zezobuchwepheshe, ukubuyela emuva okuyinhloko kwezendlalelo eziphakathi kwengilazi kuyinto evamile yemvelo kanye nokuntuleka kwamanje kwamanani okukhiqiza amakhulu. Njengoba i-ecosystem evuthwa namakhono okukhiqiza ngcono, ubuchwepheshe obususelwa kwingilazi ekuphaketheni kwe-semiconductor kungabona ukukhula okuthe xaxa nokwamukelwa.
Ngokuya nge-3D PackAging Technology, isibopho se-CU-CU SUMP-END HYBRID SEBILID iba ubuchwepheshe obuphambili bokuqamba. Le ndlela ethuthukisiwe ifinyelela ukuxhumeka okuhlala njalo ngokuhlanganisa izinto ze-dielectric (njenge-SIO2) ngezinsimbi ezishumekiwe (CU). I-CU-CU HYBRID Bonding ingafinyelela izikhala ezingaphansi kwama-micron ayi-10, imvamisa ebangeni elingu-micron-digit, elimele ukuthuthuka okukhulu kobuchwepheshe bendabuko micro-bump, okunama-bump izikhala ezingaba ngu-40-50 ama-microns acishe abe ngu-40-50 ama-microns acishe abe ngu-40-50. Izinzuzo ze-Hybrid Bonding zifaka phakathi ukukhuphuka kwe-I / O, i-bandwidth ethuthukisiwe, ethuthukisiwe yokufaka okuthe mpo kwamandla, nokuncishiswa kwamandla okuvuthayo kanye nokuphikiswa okushisayo ngenxa yokungabikho kokugcwaliswa okungezansi. Kodwa-ke, lobu buchwepheshe bunzima ukukhiqiza futhi bunezindleko eziphakeme.
I-2.5D ne-3D yokupakisha ubuchwepheshe obuhlanganisa amasu ahlukahlukene wokupakisha. Kumakethi we-2.5D, ngokuya ngokukhethwa kwezinto zokwengeza eziphakathi, kungahlukaniswa ngezigaba ezisuselwa ku-silicon, ezisuselwa ku-organic, kanye nezomqondo ezisekelwe kwingilazi, njengoba kukhonjisiwe kwisibalo ngenhla. Ekufakweni kwe-3D, ukuthuthukiswa kobuchwepheshe be-Micro-Bump Technology kuhlose ukunciphisa ubukhulu bezikhalazo, kepha namhlanje, ngokwamukela ubuchwepheshe obuhlanganisiwe be-hybrid (indlela eqondile yokuxhumanisa)
** Izitayela Zobuchwepheshe Zobuchwepheshe ongazibuka: **
1. * ** Izindawo ezinkulu ezilandelwayo eziphakathi: I-TSMC ingumhlinzeki omkhulu wezendlalelo ze-2.5D Silicon Silamedioremer, nabanye abathuthukisi be-HPC abaholayo njenge-Google ne-Amazon, futhi inkampani isanda kumemezela ukukhiqizwa kwesikhuyana kwayo okokuqala U-Idtecheex ulindele ukuthi lo mkhuba uqhubeke, ubhekene nentuthuko eyengeziwe okuxoxwe ngayo embikweni wayo ohlanganisa abadlali abakhulu.
2. ** Ukupakishwa kweleveli yephaneli: Le ndlela yokupakisha ivumela ukusetshenziswa kwezingqimba ezinkulu zomculo futhi kusiza ukunciphisa izindleko ngokukhiqiza amaphakheji amaningi ngasikhathi sinye. Naphezu kwamakhono ayo, izinselelo ezinjengokuphathwa kwe-warpage kusadingeka ukuthi zibhekwe. Ukuvelela kwalo okwandayo kukhombisa isidingo esikhulayo sezingqinamba ezikhudlwana, ezingabizi kakhulu.
I-3. Izendlalelo Ezithelisiwe ze-Glass nazo zihambisana nokupakishwa kwezinga lephaneli, enikeza amandla okusaziswa kwezindleko eziphezulu ngezindleko ezilawulwa ngokwengeziwe, okwenza kube yisixazululo esithembisayo sokwenziwa kwezobuchwepheshe okuzayo.
4. ** HBM Hybrid Bonding: Lobu buchwepheshe busetshenzisiwe emikhiqizweni ehlukene yeseva ephezulu, kufaka phakathi i-AMD Epyc ye-Stack Sram ne-CPU, kanye nochungechunge lwe-MI300 lokufaka amabhlokhi we-CPU / GPU ku-I / O lifa. I-Hybrid Bonding kulindeleke ukuthi idlale indima ebaluleke kakhulu kwintuthuko yesikhathi esizayo ye-HBM, ikakhulukazi izitaki ezi-Dram ezidlula ama-16-hi noma ama-20-hi wezabelo.
5. ** Amadivayisi ahlanganisiwe ahlanganisiwe (i-CPO): Amadivayisi we-Optical ahlanganisiwe (i-CPO) aqala ngesisombululo esibalulekile sokuthuthukisa i-I / O Bandwidth futhi anciphise ukusetshenziswa kwamandla. Uma kuqhathaniswa nokudluliselwa kukagesi kwendabuko, ukuxhumana kwe-Optical kunikeza izinzuzo eziningana, kufaka phakathi i-attedation ephansi yesiginali kumabanga amade, ancishisiwe ukuzwela kwe-crosstalk, kanye ne-bandwidth ephakeme kakhulu. Lezi zinzuzo zenza i-CPO ibe yikhethelo elihle lezinhlelo ezinhle kakhulu ze-HPC.
** Izimakethe ezibalulekile okufanele zibuke: **
Imakethe eyinhloko eshayela ukuthuthukiswa kwe-2.5D ne-3D yokupakisha ubuchwepheshe ngokungangabazeki i-computing ephezulu ye-computing (HPC). Lezi zindlela zokupakisha ezithuthukile zibalulekile ekunqobeni ukulinganiselwa komthetho we-Moore, okwenza amandla ama-transistors amaningi, inkumbulo, kanye nokuxhumeka ngaphakathi kwephakeji elilodwa. Ukuwohloka kwama-chips kuvumela nokusetshenziswa okulungile kwezindawo zenqubo phakathi kwamabhulokhi asebenzayo, njengokuhlukanisa amabhlogo we-I / O kusuka emabhulokini acubungula.
Ngaphezu kwe-computer yokusebenza okuphezulu (HPC), ezinye izimakethe kulindeleke ukuthi zithole ukukhula ngobuchwepheshe bokupakisha okuthuthukile. Emikhakheni ye-5G ne-6G, izinto ezintsha ezinjenge-antennas yokupakisha kanye nezixazululo ze-chip cut-odd zizobumba ikusasa lezakhiwo ezingenantambo (Ran) zokwakha. Izimoto ezizimele zizohlomula, njengoba lobu buchwepheshe buxhasa ukuhlanganiswa kwama-sensor suites kanye namayunithi wekhompyutha ukucubungula inani elikhulu lemininingwane ngenkathi uqinisekisa ukuphepha, ukuthembeka, ukuphepha, amandla okusebenzisa imali.
Ama-elekthronikhi wabathengi (kufaka phakathi ama-Smartphones, ama-Smartwatches, amadivaysi e-AR / VR, ama-PC, kanye nokusebenza) ayaqhubeka egxile ekucutshungweni okuningi kwedatha ezikhaleni ezincane, naphezu kokugcizelelwa okukhulu. Ukupakishwa kwe-semiconductor okuthuthukile kuzodlala indima ebalulekile kulo mkhuba, yize izindlela zokupakisha zingahluka kulawo asetshenziswa ku-HPC.
Isikhathi sePosi: Oct-07-2024