Ukupakishwa kwe-semiconductor kuvele kumiklamo yendabuko ye-1D PCB kuya ekuhlanganisweni kwe-3D eyingxubevange esezingeni eliphezulu ezingeni le-wafer. Le ntuthuko ivumela isikhala sokuxhumanisa ebangeni le-micron enedijithi eyodwa, enomkhawulokudonsa ofinyelela ku-1000 GB/s, kuyilapho kugcinwa ukusebenza kahle okukhulu kwamandla. Emgogodleni wobuchwepheshe bokupakisha be-semiconductor obuthuthukisiwe kukhona ukupakishwa okungu-2.5D (lapho izingxenye zibekwe eceleni kwesendlalelo esimaphakathi) kanye nokupakishwa kwe-3D (okubandakanya ukupakisha ama-chips asebenzayo ngokuma mpo). Lobu buchwepheshe bubalulekile ekusaseni lezinhlelo ze-HPC.
Ubuchwepheshe bokupakisha be-2.5D bubandakanya izinto ezihlukene zezingqimba ezimaphakathi, ngayinye inezinzuzo zayo kanye nokubi. Izendlalelo ze-Silicon (Si) ezimaphakathi, okuhlanganisa amawafa e-silicon angenzi lutho ngokuphelele namabhuloho e-silicon enziwe endaweni, zaziwa ngokuhlinzeka ngamakhono okufaka izintambo angcono kakhulu, azenze zilungele ukusebenzisa ikhompuyutha esebenza kahle kakhulu. Kodwa-ke, ayabiza ngokwezinto zokwakha kanye nemikhawulo yobuso endaweni yokupakisha. Ukuze kuncishiswe lezi zinkinga, ukusetshenziswa kwamabhuloho e-silicon asendaweni kuyakhula, kusetshenziswa ama-silicon ngobuchule lapho ukusebenza kahle kubalulekile ngenkathi kulungiswa izingqinamba zendawo.
Izendlalelo ze-Organic intermediary, zisebenzisa amapulasitiki abunjwe ngabalandeli, ziyindlela engabizi kakhulu kune-silicon. Bane-dielectric engaguquki ephansi, okunciphisa ukubambezeleka kwe-RC kuphakheji. Ngaphandle kwalezi zinzuzo, izendlalelo ze-organic intermediary zilwela ukuzuza izinga elifanayo lokuncishiswa kwesici soxhumano njengokupakishwa okusekelwe ku-silicon, okukhawulela ukwamukelwa kwazo ezinhlelweni zokusebenza zekhompuyutha ezisebenza kahle kakhulu.
Izendlalelo ezimaphakathi zengilazi zithole intshisekelo enkulu, ikakhulukazi kulandela ukwethulwa kwakamuva kwe-Intel kokupakishwa kwemoto yokuhlola okusekelwe engilazini. Ingilazi inikeza izinzuzo ezimbalwa, njenge-coefficient elungisekayo yokunwetshwa kwe-thermal (CTE), ukuzinza kobukhulu obuphakeme, izindawo ezibushelelezi neziyisicaba, kanye nekhono lokusekela ukukhiqizwa kwamaphaneli, okuyenza ibe ikhandidethi elithembisayo lezendlalelo ezimaphakathi ezinekhono lezintambo eliqhathaniswa ne-silicon. Kodwa-ke, ngaphandle kwezinselelo zobuchwepheshe, i-drawback eyinhloko yezingqimba zengilazi ze-intermediary i-ecosystem engavuthiwe kanye nokuntuleka kwamanje komthamo omkhulu wokukhiqiza. Njengoba i-ecosystem ikhula nekhono lokukhiqiza lithuthuka, ubuchwepheshe obusekelwe engilazini ekufakweni kwe-semiconductor bungase bubone ukukhula nokwamukelwa okwengeziwe.
Mayelana nobuchwepheshe bokupakisha be-3D, i-Cu-Cu bump-less hybrid bonding isiba ubuchwepheshe obuhamba phambili bokusungula. Le nqubo ethuthukisiwe ifinyelela ukuxhumana okuhlala njalo ngokuhlanganisa izinto ze-dielectric (njenge-SiO2) nezinsimbi ezishumekiwe (Cu). I-Cu-Cu hybrid bonding ingafinyelela izikhala ezingaphansi kwama-micron angu-10, ngokuvamile ebangeni le-micron enedijithi eyodwa, emele ukuthuthuka okuphawulekayo kunobuchwepheshe obuvamile be-micro-bump, obunokuhlukana kwamaqhubu okungaba ama-micron angu-40-50. Izinzuzo ze-hybrid bonding zihlanganisa i-I/O eyengeziwe, umkhawulokudonsa othuthukisiwe, ukupakishwa okuqondile kwe-3D okuthuthukisiwe, ukusebenza kahle kwamandla okungcono, kanye nemiphumela encishisiwe ye-parasite kanye nokumelana nokushisa ngenxa yokungabikho kokugcwalisa phansi. Nokho, lobu buchwepheshe buyinkimbinkimbi ukwenza futhi bunezindleko eziphakeme.
Ubuchwepheshe bokupakisha be-2.5D kanye ne-3D buhlanganisa amasu okupakisha ahlukahlukene. Emaphaketheni angu-2.5D, kuye ngokukhethwa kwezinto zesendlalelo esimaphakathi, zingahlukaniswa ngokwezendlalelo ze-silicon-based, organic-based, kanye nengilazi, njengoba kuboniswe esithombeni esingenhla. Ekupakishweni kwe-3D, ukuthuthukiswa kobuchwepheshe be-micro-bump kuhloswe ukunciphisa ubukhulu bezikhala, kodwa namuhla, ngokwamukela ubuchwepheshe bokuhlanganiswa kwe-hybrid (indlela yokuxhumana ye-Cu-Cu eqondile), ubukhulu bokuhlukaniswa kwedijithi eyodwa bungafinyelelwa, okumaka inqubekelaphambili ebalulekile emkhakheni. .
**Amathrendi Abalulekile Ezobuchwepheshe Ongawabuka:**
1. **Izindawo Ezinkudlwana Zesendlalelo Esixhumanisayo:** I-IDTechEx ngaphambilini yabikezela ukuthi ngenxa yobunzima bezendlalelo ze-silicon ezidlula umkhawulo kasayizi we-reticle ongu-3x, izixazululo zebhuloho le-silicon engu-2.5D maduzane zizothatha indawo yezendlalelo ze-silicon njengenketho eyinhloko yokupakisha ama-chips e-HPC. I-TSMC ingumnikezeli omkhulu wezendlalelo ze-silicon ezingu-2.5D ze-NVIDIA nabanye abathuthukisi be-HPC abahamba phambili njenge-Google ne-Amazon, futhi inkampani isanda kumemezela ukukhiqizwa ngobuningi kwesizukulwane sayo sokuqala i-CoWoS_L enosayizi we-reticle ongu-3.5x. I-IDTechEx ilindele ukuthi lo mkhuba uqhubeke, ngentuthuko eyengeziwe okuxoxwe ngayo embikweni wayo ohlanganisa abadlali abakhulu.
2. **Ukupakishwa Kwezinga Lephaneli:** Ukupakishwa kweleveli yephaneli sekugxilwe kakhulu, njengoba kugqanyiswe embukisweni we-Taiwan International Semiconductor wango-2024. Le ndlela yokupakisha ivumela ukusetshenziswa kwezingqimba ezinkulu ezimaphakathi futhi isiza ukunciphisa izindleko ngokukhiqiza amaphakheji amaningi ngesikhathi esisodwa. Naphezu kwamandla akho, izinselele ezifana nokuphathwa kwe-warpage kusadingeka kubhekwane nazo. Ukuvelela kwayo okwandayo kubonisa isidingo esikhulayo sezendlalelo zokuxhuma ezinkulu, ezingabizi kakhulu.
3. **Izendlalelo Ze-Glass Intermediary:** I-Glass ivela njengento eqinile yekhandidethi ukuze kuzuzwe izintambo ezinhle, eziqathaniswa ne-silicon, enezinzuzo ezengeziwe njenge-CTE elungisekayo nokuthembeka okuphezulu. Izendlalelo ze-Glass intermediary nazo ziyahambisana nokupakishwa kweleveli yephaneli, enikeza amandla ezintambo eziminyana kakhulu ngezindleko ezilawulekayo, okuyenza ibe yisixazululo esithembisayo sobuchwepheshe bokupakisha besikhathi esizayo.
4. **I-HBM Hybrid Bonding:** I-3D copper-copper (Cu-Cu) hybrid bonding iwubuchwepheshe obuyinhloko bokufinyelela ukuxhumana okuqondile kwe-ultra-fine pitch phakathi kwama-chips. Lobu buchwepheshe busetshenziswe emikhiqizweni ehlukahlukene yeseva esezingeni eliphezulu, okuhlanganisa i-AMD EPYC ye-SRAM estakiwe nama-CPU, kanye nochungechunge lwe-MI300 lokupakisha amabhlogo we-CPU/GPU ku-I/O efa. Ukuhlanganiswa kweHybrid kulindeleke ukuthi kudlale indima ebalulekile ekuthuthukisweni kwe-HBM okuzayo, ikakhulukazi ezitaki ze-DRAM ezedlula izendlalelo ze-16-Hi noma ezingu-20-Hi.
5. **Amadivayisi Abonakalayo Ahlanganisiwe Ahlanganisiwe (CPO):** Ngesidingo esikhulayo sokuphuma kwedatha ephezulu nokusebenza kahle kwamandla, ubuchwepheshe bokuxhuma okubonakalayo buzuze ukunakwa okukhulu. Imishini yokubona ehlanganisiwe (CPO) isiba yisixazululo esibalulekile sokuthuthukisa umkhawulokudonsa we-I/O nokunciphisa ukusetshenziswa kwamandla. Uma kuqhathaniswa nokudluliswa kukagesi okujwayelekile, ukuxhumana kwe-optical kunikeza izinzuzo ezimbalwa, okuhlanganisa ukuncishiswa kwesignali ephansi ebangeni elide, ukuzwela okuncishisiwe kwe-crosstalk, kanye nomkhawulokudonsa okhuphuka kakhulu. Lezi zinzuzo zenza i-CPO ibe inketho ekahle kumasistimu e-HPC asebenzisa idatha kakhulu, awonga amandla.
**Izimakethe Ezibalulekile Ongabukwa:**
Imakethe eyinhloko eqhuba ukuthuthukiswa kobuchwepheshe bokupakisha be-2.5D kanye ne-3D ngokungangabazeki imkhakha we-high-performance computing (HPC). Lezi zindlela zokupakisha ezithuthukisiwe zibalulekile ekunqobeni imikhawulo yoMthetho kaMoore, okuvumela ama-transistors amaningi, inkumbulo, nokuxhumana ngaphakathi kwephakheji elilodwa. Ukubola kwama-chips futhi kuvumela ukusetshenziswa okuphelele kwamanodi enqubo phakathi kwamabhulokhi ahlukene asebenzayo, njengokuhlukanisa amabhulokhi e-I/O kumabhulokhi okucubungula, kuthuthukiswe ukusebenza kahle.
Ngaphezu kwe-high-performance computing (HPC), ezinye izimakethe kulindeleke ukuthi zikhule ngokwamukelwa kobuchwepheshe bokupakisha obuthuthukile. Emikhakheni ye-5G ne-6G, izinto ezintsha ezifana nama-antenna okupakisha kanye nezixazululo ze-chip ezisezingeni eliphezulu zizololonga ikusasa lezakhiwo zenethiwekhi yokufinyelela okungenantambo (i-RAN). Izimoto ezizimele nazo zizozuza, njengoba lobu buchwepheshe busekela ukuhlanganiswa kwama-sensor suites kanye namayunithi e-computing ukuze kucutshungulwe inani elikhulu ledatha ngenkathi kuqinisekiswa ukuphepha, ukwethembeka, ukubumbana, amandla kanye nokuphathwa kokushisa, kanye nezindleko.
Izinto zikagesi zabathengi (okuhlanganisa ama-smartphones, amawashi ahlakaniphile, amadivayisi e-AR/VR, ama-PC, nezindawo zokusebenza) ziya ngokuya zigxile ekucubunguleni idatha eyengeziwe ezindaweni ezincane, naphezu kokugcizelela okukhulu ezindlekweni. Ukupakishwa kwe-semiconductor okuthuthukisiwe kuzodlala indima ebalulekile kulo mkhuba, nakuba izindlela zokupakisha zingahluka kulezo ezisetshenziswa ku-HPC.
Isikhathi sokuthumela: Oct-25-2024