I-Tiny die ngokuvamile ibhekisela kuma-semiconductor chips anosayizi omncane kakhulu, asetshenziswa kabanzi kumadivayisi ahlukahlukene kagesi, njengezingcingo eziphathwayo, izinzwa, ama-microcontroller, njll. Ngenxa yosayizi wayo omncane, i-tiny die inganikeza ukusebenza okuphezulu kuzinhlelo zokusebenza ezinesikhala esilinganiselwe.
Inkinga:
Omunye wamakhasimende kaSinho unedayi elinobubanzi obungu-0.462mm, ubude obungu-2.9mm, kanye nobukhulu obungu-0.38mm elinobukhulu obungamamitha angu-±0.005, lifuna imbobo ephakathi nendawo.
Isixazululo:
Ithimba lobunjiniyela likaSinho lisunguleiteyipu yokuthwalangezilinganiso zephakethe ezingu-0.57 × 3.10 × 0.48mm. Uma kucatshangelwa ukuthi ububanzi (Ao) betheyiphu yokuthwala bungu-0.57mm kuphela, kwabhotshozwa imbobo ephakathi engu-0.4mm. Ngaphezu kwalokho, kwaklanywa i-cross-bar ephakanyisiwe engu-0.03mm ukuze kube nephakethe elincane kangaka ukuze kuvikelwe kangcono idayi endaweni yalo, kuvinjwe ukuthi lingagingqiki liye ohlangothini noma liphenduke ngokuphelele, kanye nokuvimbela ingxenye ukuthi inamathele etheyiphuni yokumboza ngesikhathi sokucubungula kwe-SMT.
Njengokujwayelekile, ithimba likaSinho liqede ithuluzi kanye nokukhiqiza zingakapheli izinsuku eziyi-7, isivinini esaziswa kakhulu yikhasimende, njengoba lalilidinga ngokushesha ukuze lihlolwe ekupheleni kuka-Agasti. Itheyiphu yokuthwala iboshwe ku-PP corrugated plastic reel, okwenza ifanelekele izidingo zamakamelo ahlanzekile kanye nemboni yezokwelapha, ngaphandle kwamaphepha.
Isikhathi sokuthunyelwe: Juni-05-2024