I-Tiny die ngokuvamile ibhekisela kuma-semiconductor chips anosayizi omncane kakhulu, asetshenziswa kakhulu kumishini kagesi ehlukahlukene, efana nomakhalekhukhwini, izinzwa, ama-microcontrollers, njll. Ngenxa yobukhulu bayo, i- die encane inganikeza ukusebenza okuphezulu kuzinhlelo zokusebenza ezinendawo elinganiselwe.
Inkinga:
Elinye lamakhasimende kaSinho linefasi elikala u-0.462mm ububanzi, 2.9mm ubude, no-0.38mm ubukhulu nengxenye yokubekezelela engu-±0.005mm, lifuna imbobo ephakathi nendawo.
Isixazululo:
Ithimba lonjiniyela likaSinho lenze aitheyiphu yenethiwekhingephakethe izilinganiso 0.57 × 3.10 × 0.48mm. Uma kucatshangelwa ukuthi ububanzi (i-Ao) betheyiphu yenkampani yenethiwekhi bungu-0.57mm kuphela, imbobo ephakathi nendawo engu-0.4mm yabhodlozwa. Ngaphezu kwalokho, ibha enqamulayo engu-0.03mm ephakanyisiwe yayiklanyelwe iphakethe elincanyana kangaka ukuze kuvikeleke kangcono indawo yokufa, ivimbele ukuthi ingagingqiki ibheke eceleni noma ibhukuqeke ngokuphelele, futhi futhi ivimbele ingxenye ukuthi inganamatheli kukhava ngesikhathi sokucutshungulwa kwe-SMT.
Njengenjwayelo, ithimba likaSinho laqeda ithuluzi nokukhiqiza phakathi nezinsuku ezingu-7, isivinini esaziswa kakhulu ikhasimende, njengoba lalidinga ngokushesha ukuze lihlolwe ekupheleni kuka-August. Itheyiphu yenkampani yenethiwekhi ilinyazwe ku-PP kathayela we-reel, okwenza ifanele izidingo zegumbi elihlanzekile kanye nemboni yezokwelapha, ngaphandle kwanoma yimaphi amaphepha.
Isikhathi sokuthumela: Jun-05-2024