Kokubili i-SoC (System on Chip) kanye ne-SiP (System in Package) ziyingqopha-mlando ezibalulekile ekuthuthukisweni kwamasekethe ahlanganisiwe esimanje, okuvumela ukwenziwa kweminiaturization, ukusebenza kahle, kanye nokuhlanganiswa kwezinhlelo zikagesi.
1. Izincazelo kanye Nemiqondo Eyisisekelo ye-SoC ne-SiP
I-SoC (Isistimu ku-Chip) - Ukuhlanganisa lonke uhlelo lube yi-chip eyodwa
I-SoC ifana ne-skyscraper, lapho wonke amamojula asebenzayo eklanyelwe futhi ahlanganiswe ku-chip efanayo yomzimba. Umqondo oyinhloko we-SoC ukuhlanganisa zonke izingxenye ezibalulekile zohlelo lwe-elekthronikhi, okuhlanganisa iprosesa (CPU), inkumbulo, amamojula okuxhumana, amasekhethi e-analog, i-sensor interfaces, namanye amamojula ahlukahlukene asebenzayo, ku-chip eyodwa. Izinzuzo ze-SoC zisezingeni eliphezulu lokuhlanganisa kanye nosayizi omncane, ohlinzeka ngezinzuzo ezibalulekile ekusebenzeni, ukusetshenziswa kwamandla, nobukhulu, okuyenza ifaneleke kakhulu ukusebenza okuphezulu, imikhiqizo ezwela amandla. Amaphrosesa kuma-smartphones e-Apple ayizibonelo zama-chips we-SoC.
Ukufanekisa, i-SoC ifana "nesakhiwo esihle kakhulu" edolobheni, lapho yonke imisebenzi yakhelwe ngaphakathi, futhi amamojula ahlukahlukene asebenzayo afana nezitezi ezihlukene: ezinye izindawo zamahhovisi (amaprosesa), ezinye izindawo zokuzijabulisa (inkumbulo), kanti ezinye ziyizindawo zamahhovisi amanethiwekhi okuxhumana (izindawo zokuxhumana), wonke agxile esakhiweni esisodwa (chip). Lokhu kuvumela lonke uhlelo ukuthi lusebenze ku-chip eyodwa ye-silicon, izuze ukusebenza kahle okuphezulu nokusebenza.
I-SiP (Isistimu Ephaketheni) - Ukuhlanganisa ama-chips ahlukene ndawonye
Indlela yobuchwepheshe be-SiP ihlukile. Kufana nokupakisha ama-chips amaningi anemisebenzi ehlukene ngaphakathi kwephakheji efanayo. Igxile ekuhlanganiseni ama-chips amaningi asebenzayo ngobuchwepheshe bokupakisha kunokuwahlanganisa ku-chip eyodwa njenge-SoC. I-SiP ivumela ama-chips amaningi (amaphrosesa, inkumbulo, ama-RF chips, njll.) ukuthi apakishwe eceleni noma apakishwe ngaphakathi kwemojula efanayo, akhe isisombululo sezinga lesistimu.
Umqondo we-SiP ungafaniswa nokuhlanganisa ibhokisi lamathuluzi. Ibhokisi lamathuluzi lingaqukatha amathuluzi ahlukene, njengezikulufa, izando, nama-drill. Nakuba engamathuluzi azimele, wonke ahlanganiswe ebhokisini elilodwa ukuze asetshenziswe kalula. Inzuzo yale ndlela ukuthi ithuluzi ngalinye lingathuthukiswa futhi likhiqizwe ngokwehlukana, futhi "lingaqoqwa" libe yiphakheji yesistimu njengoba kudingeka, linikeze ukuguquguquka nokusheshisa.
2. Izimpawu Zezobuchwepheshe kanye Nomehluko phakathi kwe-SoC ne-SiP
Umehluko Wendlela Yokuhlanganisa:
I-SoC: Amamojula ahlukene asebenzayo (afana ne-CPU, inkumbulo, i-I/O, njll.) aklanywe ngokuqondile ku-silicon chip efanayo. Wonke amamojula abelana ngenqubo efanayo eyisisekelo kanye nengqondo yokuklama, akha uhlelo oludidiyelwe.
I-SiP: Ama-chips ahlukene asebenzayo angase akhiqizwe kusetshenziswa izinqubo ezihlukene bese ehlanganiswa kumojula yokupakisha eyodwa kusetshenziswa ubuchwepheshe bokupakisha be-3D ukuze kwakheke isistimu ebonakalayo.
Idizayini Eyinkimbinkimbi kanye Nokuvumelana nezimo:
I-SoC: Njengoba wonke amamojula ehlanganiswe ku-chip eyodwa, inkimbinkimbi yokuklama iphezulu kakhulu, ikakhulukazi ekwakhiweni kokubambisana kwamamojula ahlukene njengedijithali, i-analog, i-RF, nenkumbulo. Lokhu kudinga ukuthi onjiniyela babe nekhono lokuklama isizinda esihlukene. Ngaphezu kwalokho, uma kunenkinga yokuklama nganoma iyiphi imojula ku-SoC, yonke i-chip ingase idinge ukuklanywa kabusha, okubeka ubungozi obukhulu.
I-SiP: Ngokuphambene, i-SiP inikeza ukuguquguquka okukhulu komklamo. Amamojula ahlukene asebenzayo angaklanywa futhi aqinisekiswe ngokwehlukana ngaphambi kokuba ahlanganiswe ohlelweni. Uma kuphakama inkinga ngemojula, leyo mojula kuphela edinga ukushintshwa, okushiya ezinye izingxenye zingathinteki. Lokhu futhi kuvumela isivinini sokuthuthukiswa okusheshayo kanye nezingozi eziphansi uma ziqhathaniswa ne-SoC.
Ukuhambisana Kwezinqubo Nezinselele:
I-SoC: Ukuhlanganisa imisebenzi ehlukene njengedijithali, i-analog, ne-RF ku-chip eyodwa kubhekana nezinselele ezinkulu ekusebenzisaneni kwenqubo. Amamojula ahlukene asebenzayo adinga izinqubo ezahlukene zokukhiqiza; isibonelo, amasekhethi edijithali adinga izinqubo ezinesivinini esikhulu, ezinamandla aphansi, kuyilapho amasekhethi e-analog angase adinge ukulawulwa kwamandla kagesi okunembe kakhudlwana. Ukuthola ukuhambisana phakathi kwalezi zinqubo ezahlukene ku-chip efanayo kunzima kakhulu.
I-SiP: Ngobuchwepheshe bokupakisha, i-SiP ingahlanganisa ama-chips akhiqizwe kusetshenziswa izinqubo ezihlukene, ixazulule izinkinga zokuhambisana kwenqubo ezibhekene nobuchwepheshe be-SoC. I-SiP ivumela ama-chips amaningi ahlukahlukene ukuthi asebenze ndawonye kuphakheji efanayo, kodwa izidingo ezinembayo zobuchwepheshe bokupakisha ziphezulu.
Umjikelezo we-R&D Nezindleko:
I-SoC: Njengoba i-SoC idinga ukuklama nokuqinisekisa wonke amamojula kusukela ekuqaleni, umjikelezo wokuklama mude. Imojula ngayinye kufanele idizayinwe ngokuqinile, iqinisekiswe, futhi ihlolwe, futhi yonke inqubo yokuthuthukiswa ingase ithathe iminyaka eminingana, okuholela ezindlekweni eziphezulu. Kodwa-ke, uma sekukhiqizwe ngobuningi, izindleko zeyunithi ziphansi ngenxa yokuhlanganiswa okuphezulu.
I-SiP: Umjikelezo we-R&D mfushane ku-SiP. Ngenxa yokuthi i-SiP isebenzisa ngokuqondile ama-chips asebenzayo akhona, aqinisekisiwe ukupakisha, yehlisa isikhathi esidingekayo sokuklama kabusha kwemojuli. Lokhu kuvumela ukwethulwa komkhiqizo ngokushesha futhi kwehlisa kakhulu izindleko ze-R&D.
Ukusebenza Kwesistimu Nosayizi:
I-SoC: Njengoba wonke amamojula aku-chip efanayo, ukubambezeleka kokuxhumana, ukulahleka kwamandla, nokuphazamiseka kwesignali kuyancishiswa, okunikeza i-SoC inzuzo engenakuqhathaniswa ekusebenzeni nasekusetshenzisweni kwamandla. Usayizi wayo mncane, okuyenza ifaneleke ikakhulukazi izinhlelo zokusebenza ezinokusebenza okuphezulu nezidingo zamandla, njengama-smartphone nama-chips okucubungula izithombe.
I-SiP: Nakuba izinga lokuhlanganisa le-SiP lingekho phezulu njengele-SoC, isengakwazi ukuhlanganisa ama-chip ahlukene ndawonye kusetshenziswa ubuchwepheshe bokupakisha obunezingqimba eziningi, okuholela kusayizi omncane uma kuqhathaniswa nezixazululo zendabuko zama-chip amaningi. Ngaphezu kwalokho, njengoba amamojula ahlanganiswe ngokomzimba kunokuba ahlanganiswe ku-silicon chip efanayo, kuyilapho ukusebenza kungase kungafani nalokho kwe-SoC, kusengakwazi ukuhlangabezana nezidingo zezinhlelo zokusebenza eziningi.
3. Izimo Zokusebenza ze-SoC ne-SiP
Izimo zohlelo lokusebenza ze-SoC:
I-SoC ngokuvamile ifanele izinkambu ezinezidingo eziphezulu zosayizi, ukusetshenziswa kwamandla, nokusebenza. Ngokwesibonelo:
Ama-Smartphones: Amaphrosesa kuma-smartphones (njengama-chips we-Apple's A-series noma i-Qualcomm's Snapdragon) ngokuvamile ama-SoC ahlanganiswe kakhulu ahlanganisa i-CPU, i-GPU, amayunithi okucubungula we-AI, amamojula okuxhumana, njll., adinga kokubili ukusebenza okunamandla nokusetshenziswa kwamandla okuphansi.
Ukucutshungulwa Kwezithombe: Kumakhamera edijithali nama-drones, amayunithi okucubungula izithombe avame ukudinga amandla aqinile okucubungula afanayo kanye nokubambezeleka okuphansi, okungafinyelelwa yi-SoC ngempumelelo.
Amasistimu Ashumekiwe Asebenza Kakhulu: I-SoC ifaneleka ngokukhethekile amadivayisi amancane anezidingo eziqinile zokonga amandla, njengamadivayisi we-IoT nezinto ezigqokekayo.
Izimo zohlelo lokusebenza lwe-SiP:
I-SiP inohlu olubanzi lwezimo zohlelo lokusebenza, ezifanele izinkambu ezidinga ukuthuthukiswa okusheshayo nokuhlanganiswa kwemisebenzi eminingi, njenge:
Izisetshenziswa Zokuxhumana: Eziteshini eziyisisekelo, amarutha, njll., i-SiP ingahlanganisa amaphrosesa amaningi we-RF namasignali edijithali, isheshise umjikelezo wokuthuthukisa umkhiqizo.
I-Consumer Electronics: Ngemikhiqizo efana namawashi ahlakaniphile namahedisethi e-Bluetooth, anemijikelezo yokuthuthukisa ngokushesha, ubuchwepheshe be-SiP buvumela ukwethulwa ngokushesha kwemikhiqizo emisha yesici.
I-Automotive Electronics: Amamojula okulawula nezinhlelo ze-radar ezinhlelweni zezimoto zingasebenzisa ubuchwepheshe be-SiP ukuze bahlanganise ngokushesha amamojula ahlukene asebenzayo.
4. Amathrendi Okuthuthukisa Ikusasa le-SoC ne-SiP
Amathrendi Ekuthuthukisweni kwe-SoC:
I-SoC izoqhubeka nokuguqukela ekuhlanganisweni okuphezulu kanye nokuhlanganiswa okungafani, okungase kuhilele ukuhlanganiswa okwengeziwe kwama-AI processors, amamojula okuxhumana we-5G, neminye imisebenzi, okuqhuba ukuvela okuqhubekayo kwamadivayisi ahlakaniphile.
Okuthrendayo Ekuthuthukisweni kwe-SiP:
I-SiP izothembela kakhulu kubuchwepheshe bokupakisha obuthuthukile, obufana nentuthuko yokupakisha ye-2.5D kanye ne-3D, ukupakisha ngokuqinile ama-chips anezinqubo ezihlukene nemisebenzi ndawonye ukuze kuhlangatshezwane nezidingo zemakethe ezishintsha ngokushesha.
5. Isiphetho
I-SoC ifana nokwakha i-super skyscraper enemisebenzi eminingi, egxilisa wonke amamojula asebenzayo kumklamo owodwa, afanele izinhlelo zokusebenza ezinezidingo eziphakeme kakhulu zokusebenza, usayizi, kanye nokusetshenziswa kwamandla. I-SiP, ngakolunye uhlangothi, ifana "nokupakisha" ama-chips ahlukene asebenzayo ohlelweni, egxile kakhulu ekuguquguqukeni nasekuthuthukisweni okusheshayo, ikakhulukazi okulungele umthengi kagesi odinga izibuyekezo ezisheshayo. Zombili zinamandla azo: I-SoC igcizelela ukusebenza kahle kwesistimu nokulungiselelwa kosayizi, kuyilapho i-SiP igqamisa ukuguquguquka kwesistimu nokwenza kahle komjikelezo wokuthuthuka.
Isikhathi sokuthumela: Oct-28-2024